Principal Engineer, Packaging Engineering salary at Sandisk Technologies, Inc.
10 H-1B labor condition applications · all Sandisk Technologies, Inc. jobs · Principal Engineer, Packaging Engineering at all employers
$170,248median salary
$158,995lowest certified
$185,869highest certified
$170,248median for this title, all employers
Median salary by fiscal year
| Fiscal year | Certified LCAs | Median |
|---|---|---|
| FY2025 | 4 | $178,059 |
| FY2026 | 6 | $170,248 |
All filings
| Worksite | Salary | Wage level | Start | Status |
|---|---|---|---|---|
| San Jose, CA | $158,995up to $178,848 | Level IIIprevailing $158,995 | 09/26/2026FY2026 | Certified |
| Milpitas, CA | $158,995up to $178,848 | Level IIIprevailing $158,995 | 09/26/2026FY2026 | Certified |
| Milpitas, CA | $176,509up to $178,848 | —prevailing $176,509 | 08/01/2026FY2026 | Certified |
| San Jose, CA | $176,509up to $178,848 | —prevailing $176,509 | 08/01/2026FY2026 | Certified |
| Fremont, CA | $170,248up to $178,848 | Level IVprevailing $163,030 | 08/23/2026FY2026 | Certified |
| Milpitas, CA | $170,248up to $178,848 | Level IVprevailing $170,248 | 08/23/2026FY2026 | Certified |
| San Jose, CA | $170,248up to $172,800 | Level IVprevailing $170,248 | 09/15/2025FY2025 | Certified |
| Milpitas, CA | $170,248up to $172,800 | Level IVprevailing $170,248 | 09/15/2025FY2025 | Certified |
| Milpitas, CA | $185,869up to $195,700 | Level IVprevailing $185,869 | 08/04/2025FY2025 | Certified |
| Milpitas, CA | $185,869up to $195,700 | Level IVprevailing $185,869 | 08/04/2025FY2025 | Certified |
Other jobs at Sandisk Technologies, Inc.
| Job title | LCAs | Median salary | Range |
|---|---|---|---|
| Senior Engineer, Industrial Engineering | 41 | $94,058 | |
| Senior Engineer, VLSI Design Engineering | 31 | $127,234 | |
| Staff Engineer, Technology Development Engineering | 21 | $144,664 | |
| Principal Engineer, Product Development Engineering | 18 | $178,006 | |
| Senior Engineer, Software Development Engineering (Apps) | 16 | $136,297 | |
| Staff Engineer, VLSI Design Engineering | 13 | $129,772 | |
| Staff Engineer, Industrial Engineering | 11 | $92,976 | |
| Principal Engineer, VLSI Design Engineering | 11 | $165,275 | |
| Technologist, Firmware Engineering | 10 | $198,248 | |
| Senior Engineer, Systems Design Engineering | 8 | $126,994 | |
| Analyst 4, Business Applications | 7 | $167,362 | |
| Senior Engineer, Firmware Verification Engineering | 6 | $94,162 |
Questions and answers
How much does Sandisk Technologies, Inc. pay a Principal Engineer, Packaging Engineering on an H-1B visa?
The median salary on Sandisk Technologies, Inc.'s certified LCAs for Principal Engineer, Packaging Engineering is $170,248, ranging from $158,995 to $185,869.
Wage levels I–IV compare the offer with the prevailing wage for the occupation in the worksite area: Level I is entry level, Level IV is fully competent. Salaries are offers stated on the application; actual pay may differ.